A wafer-level encapsulated CMOS MEMS thermoresistive calorimetric flow sensor with integrated packaging design

Wei Xu; Bo Gao; Moaaz Ahmed; Mingzheng Duan; Bo Wang; Saqib Mohamad; Amine Bermak; Yi Kuen Lee

doi:10.1109/MEMSYS.2017.7863577

A wafer-level encapsulated CMOS MEMS thermoresistive calorimetric flow sensor with integrated packaging design

Wei Xu, Bo Gao, Moaaz Ahmed, Mingzheng Duan, Bo Wang, Saqib Mohamad, Amine Bermak, Yi Kuen Lee^*

^*Corresponding author for this work

CSE Information & Computing Technology

Hong Kong University of Science and Technology

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

30 Citations (Scopus)

Abstract

In this paper, we presented a wafer-level encapsulated Thermoresistive Micro Calorimetric Flow (TMCF) sensor with the integrated packaging by using the proprietary InvenSense CMOS MEMS technology. For the nitrogen gas flow from -26m/s to 26m/s, the pulsed operated TMCF sensor (device size = 3.4mm²) under the Constant Temperature Difference (CTD) mode achieved a normalized sensitivity of 112.4μV/(m/s)/mW with respect to the input heating power. Besides, the measured TMCF sensor response time (τ_max<3.63ms) shows good agreement with a theoretical model. With the pulsed operation, the proposed low-power TMCF sensor will be a promising digital CMOS MEMS flow sensor for the Internet of Things (IoT), especially for smart building/home.

Original language	English
Title of host publication	2017 IEEE 30th International Conference on Micro Electro Mechanical Systems, MEMS 2017
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	989-992
Number of pages	4
ISBN (Electronic)	9781509050789
DOIs	https://doi.org/10.1109/MEMSYS.2017.7863577
Publication status	Published - 23 Feb 2017
Event	30th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2017 - Las Vegas, United States Duration: 22 Jan 2017 → 26 Jan 2017

Publication series

Name	Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
ISSN (Print)	1084-6999

Conference

Conference	30th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2017
Country/Territory	United States
City	Las Vegas
Period	22/01/17 → 26/01/17

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10.1109/MEMSYS.2017.7863577

Cite this

Xu, W., Gao, B., Ahmed, M., Duan, M., Wang, B., Mohamad, S., Bermak, A., & Lee, Y. K. (2017). A wafer-level encapsulated CMOS MEMS thermoresistive calorimetric flow sensor with integrated packaging design. In 2017 IEEE 30th International Conference on Micro Electro Mechanical Systems, MEMS 2017 (pp. 989-992). Article 7863577 (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/MEMSYS.2017.7863577

Xu, Wei ; Gao, Bo ; Ahmed, Moaaz et al. / A wafer-level encapsulated CMOS MEMS thermoresistive calorimetric flow sensor with integrated packaging design. 2017 IEEE 30th International Conference on Micro Electro Mechanical Systems, MEMS 2017. Institute of Electrical and Electronics Engineers Inc., 2017. pp. 989-992 (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)).

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title = "A wafer-level encapsulated CMOS MEMS thermoresistive calorimetric flow sensor with integrated packaging design",

abstract = "In this paper, we presented a wafer-level encapsulated Thermoresistive Micro Calorimetric Flow (TMCF) sensor with the integrated packaging by using the proprietary InvenSense CMOS MEMS technology. For the nitrogen gas flow from -26m/s to 26m/s, the pulsed operated TMCF sensor (device size = 3.4mm2) under the Constant Temperature Difference (CTD) mode achieved a normalized sensitivity of 112.4μV/(m/s)/mW with respect to the input heating power. Besides, the measured TMCF sensor response time (τmax<3.63ms) shows good agreement with a theoretical model. With the pulsed operation, the proposed low-power TMCF sensor will be a promising digital CMOS MEMS flow sensor for the Internet of Things (IoT), especially for smart building/home.",

author = "Wei Xu and Bo Gao and Moaaz Ahmed and Mingzheng Duan and Bo Wang and Saqib Mohamad and Amine Bermak and Lee, {Yi Kuen}",

note = "Publisher Copyright: {\textcopyright} 2017 IEEE.; 30th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2017 ; Conference date: 22-01-2017 Through 26-01-2017",

year = "2017",

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doi = "10.1109/MEMSYS.2017.7863577",

language = "English",

series = "Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)",

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Xu, W, Gao, B, Ahmed, M, Duan, M, Wang, B, Mohamad, S, Bermak, A & Lee, YK 2017, A wafer-level encapsulated CMOS MEMS thermoresistive calorimetric flow sensor with integrated packaging design. in 2017 IEEE 30th International Conference on Micro Electro Mechanical Systems, MEMS 2017., 7863577, Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS), Institute of Electrical and Electronics Engineers Inc., pp. 989-992, 30th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2017, Las Vegas, United States, 22/01/17. https://doi.org/10.1109/MEMSYS.2017.7863577

A wafer-level encapsulated CMOS MEMS thermoresistive calorimetric flow sensor with integrated packaging design. / Xu, Wei; Gao, Bo; Ahmed, Moaaz et al.
2017 IEEE 30th International Conference on Micro Electro Mechanical Systems, MEMS 2017. Institute of Electrical and Electronics Engineers Inc., 2017. p. 989-992 7863577 (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

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AU - Xu, Wei

AU - Gao, Bo

AU - Ahmed, Moaaz

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AU - Mohamad, Saqib

AU - Bermak, Amine

AU - Lee, Yi Kuen

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AB - In this paper, we presented a wafer-level encapsulated Thermoresistive Micro Calorimetric Flow (TMCF) sensor with the integrated packaging by using the proprietary InvenSense CMOS MEMS technology. For the nitrogen gas flow from -26m/s to 26m/s, the pulsed operated TMCF sensor (device size = 3.4mm2) under the Constant Temperature Difference (CTD) mode achieved a normalized sensitivity of 112.4μV/(m/s)/mW with respect to the input heating power. Besides, the measured TMCF sensor response time (τmax<3.63ms) shows good agreement with a theoretical model. With the pulsed operation, the proposed low-power TMCF sensor will be a promising digital CMOS MEMS flow sensor for the Internet of Things (IoT), especially for smart building/home.

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Xu W, Gao B, Ahmed M, Duan M, Wang B, Mohamad S et al. A wafer-level encapsulated CMOS MEMS thermoresistive calorimetric flow sensor with integrated packaging design. In 2017 IEEE 30th International Conference on Micro Electro Mechanical Systems, MEMS 2017. Institute of Electrical and Electronics Engineers Inc. 2017. p. 989-992. 7863577. (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)). doi: 10.1109/MEMSYS.2017.7863577

A wafer-level encapsulated CMOS MEMS thermoresistive calorimetric flow sensor with integrated packaging design

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