@inproceedings{7026a81e9bb74457b71fa5a8121f5e20,
title = "Acoustic compression for the thermal management of multi-load electronic systems",
abstract = "This paper introduces a unique thermal management architecture that employs vapor-compression refrigeration to cool, above the dew point, multiple independently operating microprocessors in a small volume. The refrigeration system is driven by a novel acoustic compressor technology that has the virtues of, among other things, being highly variable, oil-less, and orientation independent, and thus able to operate under significant variations in loading and deployment. The paper will also, therefore, introduce acoustic compression and discuss its application to the thermal management of electronics. A prototype 5U server with four 100 W, independently variable, heat loads demonstrating the technology has been built and experimental results are reviewed.",
keywords = "Central Processing Unit, Cooling, Heat sinks, Microprocessors, Power dissipation, Refrigeration, Temperature, Thermal conductivity, Thermal management, Thermal management of electronics",
author = "Bash, {C. E.} and Patel, {C. D.} and A. Beitelmal and Burr, {Ronald F.}",
note = "Publisher Copyright: {\textcopyright} 2002 IEEE.; 8th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM 2002 ; Conference date: 30-05-2002 Through 01-06-2002",
year = "2002",
doi = "10.1109/ITHERM.2002.1012483",
language = "English",
series = "InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM",
publisher = "IEEE Computer Society",
pages = "395--402",
editor = "Sammakia, {Bahgat G.} and Joshi, {Yogendra K.} and Ganesh Subbarayan and Amon, {Cristina H.} and Koneru Ramakrishna and Sathe, {Sanjeev B.}",
booktitle = "ITHERM 2002 - 8th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems",
address = "United States",
}