TY - GEN
T1 - Modelingof the Effect of Skin Temperature on Hydration Assessment
AU - Aldisi, Reem
AU - Bermak, Amine
N1 - Publisher Copyright:
© 2021 IEEE.
PY - 2021/5/26
Y1 - 2021/5/26
N2 - Bio-electrical impedance analysis (BIA) has high potentials to be used in assessing body composition due to it being non-invasive, easy to use, safe, and low-cost. To utilize its potentials, the effect of several parameters, such as electrode design, temperature, sweat, and body movement, must be studied to design a sensor that can be used in the field rather than in clinical settings. In this paper, a human skin model is developed and simulated to analyze the BIA method. The paper focused on studying the effect of temperature on the measured resistance and capacitance in relation to the hydration levels. The work presented can be used, in addition to future analysis, as a guideline to design a hydration assessment system.
AB - Bio-electrical impedance analysis (BIA) has high potentials to be used in assessing body composition due to it being non-invasive, easy to use, safe, and low-cost. To utilize its potentials, the effect of several parameters, such as electrode design, temperature, sweat, and body movement, must be studied to design a sensor that can be used in the field rather than in clinical settings. In this paper, a human skin model is developed and simulated to analyze the BIA method. The paper focused on studying the effect of temperature on the measured resistance and capacitance in relation to the hydration levels. The work presented can be used, in addition to future analysis, as a guideline to design a hydration assessment system.
KW - Bio-impedance Analysis
KW - COMSOL Multi-physics
KW - Hydration Assessment
KW - Skin Model
KW - Temperature
UR - http://www.scopus.com/inward/record.url?scp=85113616129&partnerID=8YFLogxK
U2 - 10.1109/ICCSS51193.2021.9464173
DO - 10.1109/ICCSS51193.2021.9464173
M3 - Conference contribution
AN - SCOPUS:85113616129
T3 - 2021 4th International Conference on Circuits, Systems and Simulation, ICCSS 2021
SP - 93
EP - 97
BT - 2021 4th International Conference on Circuits, Systems and Simulation, ICCSS 2021
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 4th International Conference on Circuits, Systems and Simulation, ICCSS 2021
Y2 - 26 May 2021 through 28 May 2021
ER -