NDE of additively manufactured parts via directly bonded and mechanically attached electromechanical impedance sensors

C. Tenney; M. Albakri; C. B. Williams; P. Tarazaga

doi:10.1007/978-3-319-74421-6_35

NDE of additively manufactured parts via directly bonded and mechanically attached electromechanical impedance sensors

C. Tenney^*, M. Albakri, C. B. Williams, P. Tarazaga

^*Corresponding author for this work

Virginia Polytechnic Institute and State University

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

8 Citations (Scopus)

Abstract

Additive Manufacturing (AM) allows increased complexity which poses challenges to quality-control (QC) and non-destructive evaluation (NDE) of manufactured parts. The lack of simple, reliable, and inexpensive methods for NDE of AM parts is a significant obstacle to wider adoption of AM parts. Electromechanical impedance measurements have been investigated as a means to detect manufacturing defects in AM parts. Impedance-based NDE utilizes piezoelectric wafers as collocated sensors and actuators. Taking advantage of the coupled electromechanical characteristics of piezoelectric materials, the mechanical characteristics of the part under test can be inferred from the electrical impedance of the piezoelectric wafer. Previous efforts have used piezoelectric wafers bonded directly to the part under test, which imposes several challenges regarding the applicability and robustness of the technique. This paper investigates the use of an instrumented clamp as a solution for measuring the electromechanical impedance of the part under test. The effectiveness of this approach in detecting manufacturing defects is compared to directly bonded wafers.

Original language	English
Title of host publication	Dynamics of Civil Structures, Volume 2 - Proceedings of the 36th IMAC, A Conference and Exposition on Structural Dynamics 2018
Editors	Shamim Pakzad
Publisher	Springer Science and Business Media, LLC
Pages	263-271
Number of pages	9
ISBN (Print)	9783319744209
DOIs	https://doi.org/10.1007/978-3-319-74421-6_35
Publication status	Published - 2019
Externally published	Yes
Event	SEM Annual Conference and Exposition on Experimental and Applied Mechanics, 2018 - Greenville, United States Duration: 4 Jun 2018 → 7 Jun 2018

Publication series

Name	Conference Proceedings of the Society for Experimental Mechanics Series
ISSN (Print)	2191-5644
ISSN (Electronic)	2191-5652

Conference

Conference	SEM Annual Conference and Exposition on Experimental and Applied Mechanics, 2018
Country/Territory	United States
City	Greenville
Period	4/06/18 → 7/06/18

Keywords

Additive manufacturing
Electromechanical impedance
Manufacturing defects
Non-destructive evaluation
Piezoelectrics

Access to Document

10.1007/978-3-319-74421-6_35

Cite this

Tenney, C., Albakri, M., Williams, C. B., & Tarazaga, P. (2019). NDE of additively manufactured parts via directly bonded and mechanically attached electromechanical impedance sensors. In S. Pakzad (Ed.), Dynamics of Civil Structures, Volume 2 - Proceedings of the 36th IMAC, A Conference and Exposition on Structural Dynamics 2018 (pp. 263-271). (Conference Proceedings of the Society for Experimental Mechanics Series). Springer Science and Business Media, LLC. https://doi.org/10.1007/978-3-319-74421-6_35

Tenney, C. ; Albakri, M. ; Williams, C. B. et al. / NDE of additively manufactured parts via directly bonded and mechanically attached electromechanical impedance sensors. Dynamics of Civil Structures, Volume 2 - Proceedings of the 36th IMAC, A Conference and Exposition on Structural Dynamics 2018. editor / Shamim Pakzad. Springer Science and Business Media, LLC, 2019. pp. 263-271 (Conference Proceedings of the Society for Experimental Mechanics Series).

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title = "NDE of additively manufactured parts via directly bonded and mechanically attached electromechanical impedance sensors",

abstract = "Additive Manufacturing (AM) allows increased complexity which poses challenges to quality-control (QC) and non-destructive evaluation (NDE) of manufactured parts. The lack of simple, reliable, and inexpensive methods for NDE of AM parts is a significant obstacle to wider adoption of AM parts. Electromechanical impedance measurements have been investigated as a means to detect manufacturing defects in AM parts. Impedance-based NDE utilizes piezoelectric wafers as collocated sensors and actuators. Taking advantage of the coupled electromechanical characteristics of piezoelectric materials, the mechanical characteristics of the part under test can be inferred from the electrical impedance of the piezoelectric wafer. Previous efforts have used piezoelectric wafers bonded directly to the part under test, which imposes several challenges regarding the applicability and robustness of the technique. This paper investigates the use of an instrumented clamp as a solution for measuring the electromechanical impedance of the part under test. The effectiveness of this approach in detecting manufacturing defects is compared to directly bonded wafers.",

keywords = "Additive manufacturing, Electromechanical impedance, Manufacturing defects, Non-destructive evaluation, Piezoelectrics",

author = "C. Tenney and M. Albakri and Williams, {C. B.} and P. Tarazaga",

note = "Publisher Copyright: {\textcopyright} The Society for Experimental Mechanics, Inc 2019.; SEM Annual Conference and Exposition on Experimental and Applied Mechanics, 2018 ; Conference date: 04-06-2018 Through 07-06-2018",

year = "2019",

doi = "10.1007/978-3-319-74421-6_35",

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Tenney, C, Albakri, M, Williams, CB & Tarazaga, P 2019, NDE of additively manufactured parts via directly bonded and mechanically attached electromechanical impedance sensors. in S Pakzad (ed.), Dynamics of Civil Structures, Volume 2 - Proceedings of the 36th IMAC, A Conference and Exposition on Structural Dynamics 2018. Conference Proceedings of the Society for Experimental Mechanics Series, Springer Science and Business Media, LLC, pp. 263-271, SEM Annual Conference and Exposition on Experimental and Applied Mechanics, 2018, Greenville, United States, 4/06/18. https://doi.org/10.1007/978-3-319-74421-6_35

NDE of additively manufactured parts via directly bonded and mechanically attached electromechanical impedance sensors. / Tenney, C.; Albakri, M.; Williams, C. B. et al.
Dynamics of Civil Structures, Volume 2 - Proceedings of the 36th IMAC, A Conference and Exposition on Structural Dynamics 2018. ed. / Shamim Pakzad. Springer Science and Business Media, LLC, 2019. p. 263-271 (Conference Proceedings of the Society for Experimental Mechanics Series).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

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AU - Tenney, C.

AU - Albakri, M.

AU - Williams, C. B.

AU - Tarazaga, P.

N1 - Publisher Copyright: © The Society for Experimental Mechanics, Inc 2019.

PY - 2019

Y1 - 2019

N2 - Additive Manufacturing (AM) allows increased complexity which poses challenges to quality-control (QC) and non-destructive evaluation (NDE) of manufactured parts. The lack of simple, reliable, and inexpensive methods for NDE of AM parts is a significant obstacle to wider adoption of AM parts. Electromechanical impedance measurements have been investigated as a means to detect manufacturing defects in AM parts. Impedance-based NDE utilizes piezoelectric wafers as collocated sensors and actuators. Taking advantage of the coupled electromechanical characteristics of piezoelectric materials, the mechanical characteristics of the part under test can be inferred from the electrical impedance of the piezoelectric wafer. Previous efforts have used piezoelectric wafers bonded directly to the part under test, which imposes several challenges regarding the applicability and robustness of the technique. This paper investigates the use of an instrumented clamp as a solution for measuring the electromechanical impedance of the part under test. The effectiveness of this approach in detecting manufacturing defects is compared to directly bonded wafers.

AB - Additive Manufacturing (AM) allows increased complexity which poses challenges to quality-control (QC) and non-destructive evaluation (NDE) of manufactured parts. The lack of simple, reliable, and inexpensive methods for NDE of AM parts is a significant obstacle to wider adoption of AM parts. Electromechanical impedance measurements have been investigated as a means to detect manufacturing defects in AM parts. Impedance-based NDE utilizes piezoelectric wafers as collocated sensors and actuators. Taking advantage of the coupled electromechanical characteristics of piezoelectric materials, the mechanical characteristics of the part under test can be inferred from the electrical impedance of the piezoelectric wafer. Previous efforts have used piezoelectric wafers bonded directly to the part under test, which imposes several challenges regarding the applicability and robustness of the technique. This paper investigates the use of an instrumented clamp as a solution for measuring the electromechanical impedance of the part under test. The effectiveness of this approach in detecting manufacturing defects is compared to directly bonded wafers.

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Tenney C, Albakri M, Williams CB, Tarazaga P. NDE of additively manufactured parts via directly bonded and mechanically attached electromechanical impedance sensors. In Pakzad S, editor, Dynamics of Civil Structures, Volume 2 - Proceedings of the 36th IMAC, A Conference and Exposition on Structural Dynamics 2018. Springer Science and Business Media, LLC. 2019. p. 263-271. (Conference Proceedings of the Society for Experimental Mechanics Series). doi: 10.1007/978-3-319-74421-6_35

NDE of additively manufactured parts via directly bonded and mechanically attached electromechanical impedance sensors

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