TY - GEN
T1 - Piecewise BJT process spread compensation exploiting base recombination current
AU - Sun, Dapeng
AU - Law, Man Kay
AU - Wang, Bo
AU - Mak, Pui In
AU - Martins, Rui P.
N1 - Publisher Copyright:
© 2017 IEEE.
PY - 2017/9/25
Y1 - 2017/9/25
N2 - In this paper, a piecewise bipolar junction transistor (BJT) process spread compensation scheme is presented. By exploiting the strong correlation between the BJT saturation current and the piecewise base recombination current, the process spread and proportional-to-absolute-temperature (PTAT) drift of the base-emitter voltage (Vbe) can be reduced over a wide temperature range. Fabricated in standard 0.18-μm CMOS, the chip prototype achieves a measured Vbe standard deviation (STD) of 1.1 mV (1.8 mV) from -30 to 60 °C (-30 to 120 °C) over 12 samples, corresponding to a 2.9X (1.8X) improvement when compared to the measured Vbe STD of 3.24 mV at 25 °C from 15 standalone BJT samples with constant external bias current using the same process.
AB - In this paper, a piecewise bipolar junction transistor (BJT) process spread compensation scheme is presented. By exploiting the strong correlation between the BJT saturation current and the piecewise base recombination current, the process spread and proportional-to-absolute-temperature (PTAT) drift of the base-emitter voltage (Vbe) can be reduced over a wide temperature range. Fabricated in standard 0.18-μm CMOS, the chip prototype achieves a measured Vbe standard deviation (STD) of 1.1 mV (1.8 mV) from -30 to 60 °C (-30 to 120 °C) over 12 samples, corresponding to a 2.9X (1.8X) improvement when compared to the measured Vbe STD of 3.24 mV at 25 °C from 15 standalone BJT samples with constant external bias current using the same process.
KW - Bipolar junction transistor (BJT)
KW - base recombination current
KW - piecewise process spread compensation
UR - http://www.scopus.com/inward/record.url?scp=85032663010&partnerID=8YFLogxK
U2 - 10.1109/ISCAS.2017.8050475
DO - 10.1109/ISCAS.2017.8050475
M3 - Conference contribution
AN - SCOPUS:85032663010
T3 - Proceedings - IEEE International Symposium on Circuits and Systems
BT - IEEE International Symposium on Circuits and Systems
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 50th IEEE International Symposium on Circuits and Systems, ISCAS 2017
Y2 - 28 May 2017 through 31 May 2017
ER -