TY - JOUR
T1 - Radiation-Hardened CMOS Negative Voltage Reference for Aerospace Application
AU - Liu, Fan
AU - Yang, Feng
AU - Wang, Han
AU - Xiang, Xun
AU - Zhou, Xichuan
AU - Hu, Shengdong
AU - Lin, Zhi
AU - Bermak, Amine
AU - Tang, Fang
N1 - Publisher Copyright:
© 2017 IEEE.
PY - 2017/9
Y1 - 2017/9
N2 - Voltage reference is the key module in analog and mixed-signal integrated circuits. This paper presents a radiation-hardened CMOS negative voltage reference for aerospace electronics. To improve the antiradiation performance, in the circuit design, the input pair of the operational amplifier is replaced from pMOS to nMOS. An extra unity-gain amplification stage is added and the compensation network is optimized. Besides, the start-up circuit is redesigned. In the layout design, the annular-gate structure is adopted to eliminate electric leakage, while the layout technique against single-event latch-up is also used. The prototype of the proposed circuit is fabricated using a bulk CMOS 0.6-μm process with a 547μm× 618μm chip area. By using the proposed circuit and layout optimizations, the measured temperature coefficient of reference is reduced to 13 ppm/°C and the output voltage drift is below 1.2% after 300-krad(Si) total ionizing dose. The measured single-event latch-up threshold is above 94.6 MeVcm2/mg.
AB - Voltage reference is the key module in analog and mixed-signal integrated circuits. This paper presents a radiation-hardened CMOS negative voltage reference for aerospace electronics. To improve the antiradiation performance, in the circuit design, the input pair of the operational amplifier is replaced from pMOS to nMOS. An extra unity-gain amplification stage is added and the compensation network is optimized. Besides, the start-up circuit is redesigned. In the layout design, the annular-gate structure is adopted to eliminate electric leakage, while the layout technique against single-event latch-up is also used. The prototype of the proposed circuit is fabricated using a bulk CMOS 0.6-μm process with a 547μm× 618μm chip area. By using the proposed circuit and layout optimizations, the measured temperature coefficient of reference is reduced to 13 ppm/°C and the output voltage drift is below 1.2% after 300-krad(Si) total ionizing dose. The measured single-event latch-up threshold is above 94.6 MeVcm2/mg.
KW - Aerospace electronics
KW - CMOS voltage reference
KW - analog integrated circuit
KW - radiation hardening
KW - single-event latch-up
KW - voltage drift
UR - http://www.scopus.com/inward/record.url?scp=85028936611&partnerID=8YFLogxK
U2 - 10.1109/TNS.2017.2733738
DO - 10.1109/TNS.2017.2733738
M3 - Article
AN - SCOPUS:85028936611
SN - 0018-9499
VL - 64
SP - 2505
EP - 2510
JO - IEEE Transactions on Nuclear Science
JF - IEEE Transactions on Nuclear Science
IS - 9
M1 - 7997771
ER -