System-Level Modeling and Design of a Temperature Compensated CMOS MEMS Thermal Flow Sensor

Zhijuan Li, Zetao Fang, Bo Wang, Moaaz Ahmed, Xiaofang Pan, Su Ting Han, Xiaojin Zhao, Wei Xu*

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

2 Citations (Scopus)

Abstract

In this paper, we present a system-level model for an ambient temperature-compensated CMOS MEMS Thermal Flow (C2 MTF) sensor. The system-level model is first validated by a computational fluid dynamics (CFD) model and is further used for a fully coupled simulation between the microstructure, heat transfer, and interface circuits. Correspondingly, a monolithically integrated C2 MTF sensor is designed and optimized using a 0.18 μm 1P6M CMOS MEMS technology. The designed System on Chip (SoC) C2 MTF sensor has a flow range of-1010 m/s, and its highest sensitivity is 0.274 V/(m/s) with a system power consumption of less than 3.6 mW. In comparison with the more than 50% output drift for the uncompensated counterpart, the output drift of the designed C2 MTF sensor is reduced to 7% under an ambient temperature of 050 °C. In addition, based on the proposed system-level model, the additional optimizations show that the output drift can be greatly reduced to 0.5%, by arranging another on-chip overheated temperature-regulating resistor Rc in the future, delicately.

Original languageEnglish
Title of host publicationIEEE International Symposium on Circuits and Systems, ISCAS 2022
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages2072-2076
Number of pages5
ISBN (Electronic)9781665484855
DOIs
Publication statusPublished - 2022
Event2022 IEEE International Symposium on Circuits and Systems, ISCAS 2022 - Austin, United States
Duration: 27 May 20221 Jun 2022

Publication series

NameProceedings - IEEE International Symposium on Circuits and Systems
Volume2022-May
ISSN (Print)0271-4310

Conference

Conference2022 IEEE International Symposium on Circuits and Systems, ISCAS 2022
Country/TerritoryUnited States
CityAustin
Period27/05/221/06/22

Keywords

  • CMOS MEMS thermal flow sensor
  • SoC
  • monolithic integration
  • system-level model
  • temperature compensation

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