Thermal considerations in cooling large scale high compute density data centers

C. D. Patel, R. Sharma, C. E. Bash, A. Beitelmal

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

93 Citations (Scopus)

Abstract

A high compute density data center of today is characterized as one consisting of thousands of racks each with multiple computing units. The computing units include multiple microprocessors, each dissipating approximately 250 W of power. The heat dissipation from a rack containing such computing units exceeds 10 KW. Today's data center, with 1000 racks, over 30,000 square feet, requires 10 MW of power for the computing infrastructure. A 100,000 square foot data center of tomorrow will require 50 MW of power for the computing infrastructure. Energy required to dissipate this heat will be an additional 20 MW. A hundred thousand square foot planetary scale data center, with five thousand 10 KW racks, would cost ∼$44 million per year (@ $100/MWh) just to power the servers & $18 million per year to power the cooling infrastructure for the data center. Cooling design considerations by virtue of proper layout of racks can yield substantial savings in energy. This paper shows an overview of a data center cooling design and presents the results of a case study where layout change was made by virtue of numerical modeling to avail efficient use of air conditioning resources.

Original languageEnglish
Title of host publicationITHERM 2002 - 8th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems
EditorsBahgat G. Sammakia, Yogendra K. Joshi, Ganesh Subbarayan, Cristina H. Amon, Koneru Ramakrishna, Sanjeev B. Sathe
PublisherIEEE Computer Society
Pages767-776
Number of pages10
ISBN (Electronic)0780371526
DOIs
Publication statusPublished - 2002
Externally publishedYes
Event8th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM 2002 - San Diego, United States
Duration: 30 May 20021 Jun 2002

Publication series

NameInterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM
Volume2002-January
ISSN (Print)1936-3958

Conference

Conference8th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM 2002
Country/TerritoryUnited States
CitySan Diego
Period30/05/021/06/02

Keywords

  • Air conditioning
  • Computational fluid dynamics
  • Cooling
  • Data mining
  • Foot
  • Large-scale systems
  • Numerical models
  • Power system modeling
  • Temperature distribution
  • Thermal management

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